EMI Receptacles

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EMI Receptacles

Methode's dataMateTM brand of SFP, SFP+ and XFP cages are fully compliant with the IEEE Multi-Source Agreement (MSA) specification. The cages' one-piece metal construction provides superior EMI shielding performance for all transmission protocols, including Fibre Channel, Gigabit Ethernet and Infiniband and can receive either copper or optical modules. Cage designs are also available with pin and plating options to address press-fit and solder applications.

Custom Solutions	Flexibiliity	Manufacturing Options
While dataMate cages are designed specifically to meet the specifications of existing printed circuit boards (PCBs), custom solutions are available and supported by a knowledgeable staff and quick service. dataMate offers a variety of cages, including single- and multi-port options, lightpipes, plating and shielding. dataMate cages allow for various manufacturing processes and board design options, including Solderable Process and Press Fit Process. Additionally, various pin lengths are available to accommodate a multitude of board thicknesses

EMI Receptacle Solutions

dataMate offers superior EMI shielding, MSA compliant single- and multi-port cages for SFP, SFP+, XFP, and QSFP+.

QSFP+ Cages

QSFP+ Cages are robust, MSA compliant, and has a unique spring loaded heat sink clip.

How we customize:

dataMate’s QSFP+ Cages offer a wide range of customizable options including lightpipe and thru design, along with heat sink options.

SFP Cages

SFP Cages feature an improved kick-out spring design and customizable port options and other features.

HOW WE CUSTOMIZE

dataMate’s SFP Cages offer a wide range of customizable options including plating, RoHS, lightpipes, footprints, press fit and solder tail versions.

SFP+ Cages

SFP+ Cages offer all of the features of the SFP Cages plus spot-welded gaskets to reduce wall thickness without compromising its strength.

HOW WE CUSTOMIZE

dataMate’s SFP+ Cages offer a wide range of customizable options including plating, RoHS, lightpipes, press fit, solder tail, and thermal management (NEW).