| These surface mount sockets accept the new post molded plastic chip
carriers conforming to JEDEC specification MO-47.
Features & Benefits
- High temperature plastic is IR
reflow compatible
- Compatible footprint allows for
socket or direct mount Housing slots accept extraction tool for easy PLCC
removal.
- Pin 1 indicator and corner chamfer
for PLCC orientation.
- Contact design provides constant
downward force on chip to prevent disengagement.
- Preloaded contacts yield low
insertion force while maintaining high normal force.
- Plastic standoffs offer clearance
for heat dissipation and cleaning operations.
- Open bottom housing provides
convenient placement of socket to pattern, 100% inspection of solder joint,
solder repair without housing removal and penetration of heat source to the
solder pad and surface mount contact.
- Top contact slots allow test probing
with PLCC device in place
- Raised ribs ensure positive chip
location and ease of chip insertion
- Optional polarizing pegs offer
design versatility
- Center pad facilitates vacuum pick
and place and/or adhesive bonding
Specifications
|
 Electrical
- Contact interference resistance
initial: 6.5 milliohms maximum
final: 15 milliohms maximum
- Insulation resistance: > 10,000
megohms
- Dielectric strength: 1,000 VAC for 1
min
- Capacitance: < 1.0 pF at 1,000 Hz
- Self Inductance: 5.0 nH maximum at
500 kHz
Mechanical
- Durability: 100 mating cycles
- Vibration: 10,000 - 20,000 Hz, 5 GS
- Acceleration: 15 GS Shock: 35
GS
Environmental
- Temperature/Humidity: contact
resistance change, 20 milliohms, maximum
- Thermal shock: cycled from
-55°C to +80°C no discontinuity or physical damage
- Corrosive atmosphere: contact
resistance change, 20 milliohms, maximum
- Operating temperature: -55°C to
+125°C
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