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Apr. 26, 2012

Methode's Data Solutions Group Develops SFP+ Multi-Port Cages with Thermal Management

dataMate™, a division of Methode Electronics, Inc.’s (NYSE: MEI) Data Solutions Group, announced today the development of a patent pending SFP+ cage system with advanced thermal management features to prevent data error and hardware failure due to excessive heat.

The trend in the pluggable module space of ever increasing bandwidth coupled with decreasing form factors and contiguous multi-port configurations is creating a new challenge to manage greater power consumption in small footprints. To address this challenge, dataMate™ has developed a new cage system which utilizes a series of thermally conductive compliant fingers that make direct contact with an SFP+ module to dissipate heat from the module housing. These thermally conductive fingers are then coupled to a heatsink designed to maximize heat transfer. Because there are many fingers that are independently compliant, this system accounts for irregularities across the surface of the module. The heatsink fin design and orientation can be customized to take advantage of the particular airflow in an application, and heat pipes can be incorporated to transfer heat to remote heatsinks for optimal location within space constraints.

For more information on this new patent pending product or any of dataMate™'s other high-speed copper solutions, please visit dataMate's new website at http://www.methode.com/data/emi-receptacles/sfp-plus-cages.html

dataMate™ Products is a leading manufacturer of 1Gigabit to 10 Gigabit Ethernet products, computer I/O terminators and interconnect circuits, computer peripheral adapters, SCSI testers, and SCSI signal repeaters. All products benefit from sophisticated CAD/CAE electrical and mechanical design techniques, as well as from Methode's considerable manufacturing expertise. dataMate™ is located in Chicago, IL.





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