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Thermal Management

As a leader in thermal management, we provide cooling solutions to protect power electronics in the most demanding environments. Methode designs and manufactures thermal solutions such as extruded aluminum heat sinks, bonded-fin heat sinks, liquid-cooled chill plates and blocks, and SCR Clamps. Our experienced teams of applications engineers, supported by our regional design centers, collaborate with our customers to provide thermal analysis support and quickly turn concepts into high-performance, cost-effective solutions.

Our Thermal Management Solutions & Capabilities

Our unique, customizable thermal management solutions are designed to work with high-performance applications, and protect high-power systems.

Extruded Heat Sinks

Since the development of power semiconductors, cooling needs have been provided by attaching a one-piece aluminum extrusion to provide a large surface cooling area. Methode provides a broad selection of tooled, SCR and high-ratio extrusion profiles.

HOW WE CUSTOMIZE

Methode can create custom profiles to meet specific thermal requirements.

Bonded-Fin Heat Sinks

Methode provides bonded-fin capabilities to meet high-power, forced-convection applications.

HOW WE CUSTOMIZE

Methode can modify fin height and base width to meet specific thermal requirements.

Liquid Cooled

The drive towards higher-power electronics and more compact packages is making liquid cooling a necessity in many applications.

HOW WE CUSTOMIZE

Fluid paths can be customized to dissipate heat from local hotspots according to specific component layouts.

SCR Clamps

We have SCR Clamps ranging from loads of 700 lbs. (363 kg.) to 20,000 lbs. (9,072 kg.) of force; and can design custom clamps for specific needs.

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