Extruded Heat Sinks

In today’s compact designs, relatively fragile power semiconductors generally require a one-piece aluminum extruded heat sink to limit their temperature rise and prevent premature failure. Methode’s standard tooled extrusion heat sinks satisfy a broad range of semiconductor cooling needs, and can be used for most industry-standard semiconductor cases, including power modules, IGBTs and isolated flat-base devices. In addition, they can be extruded up to 21 in. wide and custom-machined to meet special mounting needs.

• Extrusions up to 21 in. wide
• 21 in. wide heat sinks with ratios as high as 10:1
• Can be machined to meet your packaging needs
• Multiple extrudable aluminum alloy choices
• Multiple plating options

Methode provides a variety of SCR heat sinks to go along with our line of SCR clamps for pressure-mounted SCR disc-pak devices. These heat sinks vary in size and thermal performance and can be machined to meet our wide range of SCR clamp bolt configurations.

• Can be machined to meet SCR clamp bolt configurations
• Designed specifically for our SCR clamps
• Multiple plating options

For higher performance air-cooled applications, heat-sink designs may require higher fin densities. Methode can push extrusions with aspect ratios up to 16:1, resulting in larger surface area and better thermal performance. These high-ratio extrusions can have widths up to 11.5 in. Fin heights vary depending on a 14 in. circle size.

• Currently four 16:1 high-ratio extrusions available
• Extrusion capability up to 11.5 in. wide
• Considerable cost savings compared to bonded fins
• Can be stir-welded to meet larger widths
• Up to a twelve percent increase in thermal performance over a 12:1
• Multiple plating options