In today’s compact designs, relatively fragile power semiconductors generally require a one-piece aluminum extruded heat sink to limit their temperature rise and prevent premature failure. Methode’s standard tooled extrusion heat sinks satisfy a broad range of semiconductor cooling needs, and can be used for most industry-standard semiconductor cases, including power modules, IGBTs and isolated flat-base devices. In addition, they can be extruded up to 21 in. wide and custom-machined to meet special mounting needs.
- Extrusions up to 21 in. wide
- 21 in. wide heat sinks with ratios as high as 10:1
- Can be machined to meet your packaging needs
- Multiple extrudable aluminum alloy choices
- Multiple plating options