Sonicrimp

Methode Development Company's patented process, Sonicrimp®, provides a simple, elegant and efficient technique for mass termination of wires and contacts, of virtually any size and combination, to a wide variety of surfaces and substrates. Offering waterproof and low-resistance electrical connections, Sonicrimp is utilized in disposable single-patient use applications, sensor solutions for patient monitoring, and RFID infant security and wandering resident applications.

No solder, IDC or conductive adhesives required
Offers higher density potential
Utilizes ultrasonic welding
Maintains contact and wire compression even after extended heat aging and thermal cycling
Includes moisture barriers for environmentally sealed connections
Provides special mounting designs for superior strain relief to the cable
Features rounded edges for comfort and safety
Won't crack or increase resistance like conductive adhesives
Offers ergonomic finger grips for added efficiency and safety

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Attributes

Green Technology
Solder free, the Sonicrimp process eliminates the use of potentially hazardous materials as well as the contamination and cleaning associated with various solder processes.

Multiple Functions in a Single Terminal
MDC's patented process features environmental sealing, mounting features and other mechanical performance criteria.

Cable Strain Relief
Our engineers mold a cable strain relief into the cap and cradle, eliminating a component and reducing the steps in the assembly process.